Gallium oxide (Ga2₂O3) — especially in its most stable β phase — is attracting strong interest as an ultra-wide bandgap (UWBG) semiconductor with the potential to redefine power electronics beyond the limits of silicon carbide (SiC) and gallium nitride (GaN). Expert analysis by Guido Ueberreiter, VP Semiconductor Strategy, Von Ardenne.
With a bandgap energy of about 4.7–4.9 eV, significantly wider than typical wide bandgap materials (~3.3–3.4 eV), Ga2₂O3₃ enables higher breakdown fields and superior power device performance that are crucial for efficient, high-voltage switching applications such as electric vehicles, renewable energy converters, and industrial power supplies.
A key metric in power electronics is Baliga’s figure of merit (BFOM), which relates breakdown field to charge carrier mobility and directly reflects how effectively a semiconductor minimises conduction losses at high voltages.
For B-Ga2₂O3₃, BFOM values are projected to greatly exceed those of SiC and GaN, making Ga2₂O3 a compelling candidate for high-voltage (>1 kV) devices. However, Ga2₂O3 also exhibits lower thermal conductivity than SiC and GaN, which poses challenges for thermal management in high-power devices — a focus of ongoing research.
A distinct advantage of Ga2₂O3₃lies in its substrate growth scalability. Unlike SiC or GaN, βB-Ga2₂O3 single crystals can be produced by relatively low-cost melt growth methods, compatible with large wafer sizes, thus promising lower substrate costs and simpler manufacturing pathways.
This scalability amplifies Ga2₂O3’s appeal for commercial adoption if high-performance device structures can be reliably realised.
To harness these material advantages, researchers are developing thin-film Ga2₂O3 growth methods tailored for device fabrication.
While vapor-phase epitaxial techniques such as metal–organic chemical vapor deposition (MOCVD) and hydride vapor phase epitaxy (HVPE) dominate high-crystal-quality growth, physical vapor deposition (PVD) methods like sputtering and pulsed laser deposition (PLD) are gaining attention for their flexibility, lower equipment cost, and compatibility with large-area substrates.
PVD techniques work by vaporising a solid source material (such as a Ga2₂O3 target) in a vacuum and condensing it onto a substrate.
For oxide materials, pulsed laser deposition (PLD) is a common variant in which a high-energy laser ablates material from a target, producing a plume that deposits as a thin film on a heated substrate.
Similarly, magnetron sputtering — another PVD approach — uses ionized gas to eject atoms from a target toward a substrate. These methods allow precise control over film thickness, composition, and microstructure, essential for optimizing electronic properties.
Studies have shown that by adjusting PVD parameters and post-deposition annealing, Ga2₂O3 films with improved crystallinity and tailored defect densities can be achieved, which are critical for device performance and reliability.
PVD’s lower thermal budget compared to some chemical vapor deposition (CVD) processes also enables growth on substrates that may not tolerate high temperatures, broadening the integration options for Ga2₂O3₃in multi-material device stacks.
Moreover, PVD methods are inherently compatible with standard semiconductor fabrication infrastructure, facilitating potential integration into commercial production lines and reducing overall manufacturing costs once optimised at scale.
In summary, Ga2₂O3₃stands out as an ultra-wide bandgap semiconductor with the right combination of electronic properties and substrate scalability to drive next-generation power electronics.
Coupled with advances in PVD thin-film growth techniques that promise more cost-efficient, scalable production, Ga2₂O3₃could significantly lower device costs and enhance performance — pushing power electronics into new realms of efficiency and capability.
As a technology pioneer in PVD technologies and a provider of thin-film deposition equipment, VON ARDENNE is working on advancing ultra-wide bandgap material development.
